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XCVC1902-2HSIVSVD1760
Part number:
XCVC1902-2HSIVSVD1760
CLASSIFICATION:
Integrated Circuits (ICs)
manufacturer:
Xilinx (AMD)
describe:
IC VERSAL AI-CORE FPGA 1760BGA
package:
Tray
ROHS status:
Yes
currency:
USD
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inventory 1600
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quantity
unit price
price
1
47267
47267
specifications
  • Architecture
    MPU, FPGA
  • RAM Size
    256KB
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Core Processor
    Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Peripherals
    DDR, DMA, PCIe
  • Package / Case
    1760-BFBGA, FCBGA
  • Supplier Device Package
    1760-FCBGA (40x40)
  • Number of I/O
    726
  • Speed
    800MHz, 1.65GHz

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